Chuck for supporting a wafer
US10446434B2 · kind B2 · utility
0Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2016 |
| Grant date | Oct 15, 2019 |
| Priority date | — |
| Expiry date | Jun 27, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67092
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to an embodiment, a support module is provided for supporting a substrate. The support module may include a chuck and a vertical stage. The chuck may include multiple chuck segments that are independently movable. When the substrate is positioned on the chuck, different chuck segments are positioned under different areas of the substrate. The vertical stage may include multiple piezoelectric motors. Each piezoelectric motor may be configured to perform nanometric scale elevation and lowering movements. The multiple piezoelectric motors may be configured to independently move the multiple chuck segments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.