Copper foil, copper-clad laminate board, method for producing printed wiring board, method for producing electronic apparatus, method for producing transmission channel, and method for producing antenna
US10448507B2 · kind B2 · utility
0Cited by
5References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 13, 2017 |
| Grant date | Oct 15, 2019 |
| Priority date | — |
| Expiry date | Jun 30, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0355
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
To provide a copper foil and a copper-clad laminate board that have a favorably suppressed transmission loss even in the use thereof in a high frequency circuit board that is folded in use or bent in use. A copper foil having a number of times of folding of 1 or more in a folding test under a prescribed condition for a copper-clad laminate board containing the copper foil having adhered thereto an insulating substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.