Semiconductor package device with integrated antenna and manufacturing method thereof
US10460987B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2017 |
| Grant date | Oct 29, 2019 |
| Priority date | — |
| Expiry date | May 9, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73267
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a semiconductor package device, which includes a semiconductor die and a redistribution layer disposed over and electrically coupled to the semiconductor die. The redistribution layer includes a first conductive plate, a second conductive plate disposed over the first conductive plate, an insulating film between the first conductive plate and the second conductive plate, and a first dielectric material encapsulating the first conductive plate, the second conductive plate and the insulating film. The first conductive plate and the second conductive plate are configured as an antenna plane and a ground plane, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.