Fabrication method of electronic module
US10461002B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Jul 11, 2017 |
| Grant date | Oct 29, 2019 |
| Priority date | — |
| Expiry date | Oct 11, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49169
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic module is provided, including an electronic element and a strengthening layer formed on a side surface of the electronic element but not formed on an active surface of the electronic element so as to strengthen the structure of the electronic module. Therefore, the electronic element is prevented from being damaged when the electronic module is picked and placed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.