Patent · US Active

Package with partially encapsulated cooling channel for cooling an encapsulated chip

US10461017B2 · kind B2 · utility

1Cited by

0References

15Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Andreas Grassmann · Villach, AT
Wolfram Hable · Dresden, DE
Juergen Hoegerl · Regensburg, DE
Ivan Nikitin · Regensburg, DE
Achim Strass · Munich, DE

Key dates

Filing date	Aug 1, 2017
Grant date	Oct 29, 2019
Priority date	—
Expiry date	Aug 1, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/13091
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A power module which comprises a semiconductor chip, at least one cooling plate with at least one cooling channel thermally coupled to the semiconductor chip and being configured so that a coolant is guidable through the at least one cooling channel, and an encapsulant encapsulating at least part of the semiconductor chip and part of the at least one cooling channel, wherein at least part of a main surface of the cooling plate forms part of an external surface of the power module.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.