Substrate polishing method, top ring, and substrate polishing apparatus
US10464185B2 · kind B2 · utility
2Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2017 |
| Grant date | Nov 5, 2019 |
| Priority date | — |
| Expiry date | Jan 2, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
According to one embodiment, a substrate polishing method includes: conveying a substrate to a position above a polishing pad by sucking the substrate by a first region of an elastic film; polishing the substrate while bringing the substrate into contact with the polishing pad; and lifting off the substrate by sucking the substrate by a second region of the elastic film, the second region being larger than the first region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.