Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board
US10464291B2 · kind B2 · utility
1Cited by
14References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2017 |
| Grant date | Nov 5, 2019 |
| Priority date | — |
| Expiry date | Jan 31, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A copper heat dissipation material having a satisfactory heat dissipation performance is provided. The copper heat dissipation material has an alloy layer containing at least one metal selected from Cu, Co, Ni, W, P, Zn, Cr, Fe, Sn and Mo on one or both surfaces, in which surface roughness Sz of the one or both surfaces, measured by a laser microscope using laser light of 405 nm in wavelength, is 5 μm or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.