Semiconductor device inspection of metallic discontinuities
US10466179B2 · kind B2 · utility
0Cited by
2References
12Claims
0Family size
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Key dates
| Filing date | Mar 22, 2018 |
| Grant date | Nov 5, 2019 |
| Priority date | — |
| Expiry date | Mar 22, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/8883
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Concepts presented herein relate to approaches for performing substrate inspection. In one aspect, the concepts relate to detecting anomalies or candidate defects on the substrate based on contrast in images obtained of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.