Method for producing a self-aligning masking layer
US10468248B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2017 |
| Grant date | Nov 5, 2019 |
| Priority date | — |
| Expiry date | Dec 2, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/102
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In various embodiments, a method is provided. The method may include forming a buried electrically charged region at a predefined position in a first layer in such a way that the buried electrically charged region generates an electric field having a lateral inhomogeneous field distribution above the first layer, and forming a second layer above the first layer using the field distribution in such a way that a structure of the second layer correlates with the position of the buried electrically charged region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.