Automated resistance and capacitance extraction and netlist generation of logic cells
US10482212B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2018 |
| Grant date | Nov 19, 2019 |
| Priority date | — |
| Expiry date | Apr 19, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is technology for evaluating the performance, power, area, and cost of a new or significantly modified IC fabrication process. A layout of a circuit design is provided, the circuit design including pins, transistors, and interconnects. The interconnects have at least two endpoints, each of the endpoints being either a terminal of a transistor or a pin in the circuit design. The locations for a plurality of transistor and interconnect endpoints in the layout are identified. A three-dimensional circuit representation is fabricated in accordance with the layout and the fabrication process. Parasitic resistance and capacitance values are estimated for pairs of interconnect endpoints which share an interconnect in the three-dimensional circuit representation. An annotated netlist is developed for the plurality of the transistors interconnects endpoints identified from the layout, and which further indicates the parasitic resistance values and parasitic capacitance values estimated from the three-dimensional circuit representation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.