Object preparation device and particle beam device having an object preparation device and method for operating the particle beam device
US10483084B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 27, 2018 |
| Grant date | Nov 19, 2019 |
| Priority date | — |
| Expiry date | Feb 27, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2801
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The system described herein relates to an object preparation device for preparing an object in a particle beam apparatus. By way of example, the particle beam apparatus is an electron beam apparatus and/or an ion beam apparatus. The system described herein moreover relates to a particle beam apparatus having such an object preparation device and to a method for operating the particle beam apparatus. The object preparation device may have an object receptacle device for receiving the object, a cutting device and a cutting bevel for cutting the object, wherein the cutting bevel may be arranged at the cutting device. The cutting bevel may lay in a cutting plane. Further, an axis of rotation may lay in the cutting plane. The cutting bevel may be embodied to be rotatable about the axis of rotation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.