Selection of polishing parameters to generate removal or pressure profile
US10493590B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2015 |
| Grant date | Dec 3, 2019 |
| Priority date | — |
| Expiry date | May 12, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/45232
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
Values are selected for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head with a plurality of zones to apply independently controllable pressures on a substrate. Data is stored relating variation in removal profile on a front surface of the substrate to variation in the controllable parameters, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers. A value is determined for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on a front surface of the substrate to variation in the parameters. The value for each parameter of the plurality of controllable parameters is stored.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.