Electrostatic chuck and method of making same

US10497598B2 · kind B2 · utility

Assignee

• ENTEGRIS, INC. · US

Inventors

• Richard A. Cooke · Framingham, US
• Wolfram Neff · Buffalo, US
• Carlo Waldfried · Falls Church, US
• Jakub Rybczynski · Arlington, US
• Michael J. Hanagan · Grafton, US
• Wade A. Krull · Marblehead, US

Key dates

• Filing date: Feb 6, 2015
• Grant date: Dec 3, 2019
• Expiry date: Jun 5, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/6831
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electrostatic chuck includes a ceramic structural element, at least one electrode disposed on the ceramic structural element, and a surface dielectric layer disposed over the at least one electrode, the surface layer activated by a voltage in the electrode to form an electric charge to electrostatically clamp a substrate to the electrostatic chuck. The surface dielectric layer comprises: (i) an insulator layer of amorphous alumina, of a thickness of less than about 5 microns, disposed over the at least one electrode; and (ii) a stack of dielectric layers disposed over the insulator layer. The stack of dielectric layers includes: (a) at least one dielectric layer including aluminum oxynitride; and (b) at least one dielectric layer including at least one of silicon oxide and silicon oxynitride.