Method for direct bonding of substrates including thinning of the edges of at least one of the two substrates
US10497609B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 10, 2016 |
| Grant date | Dec 3, 2019 |
| Priority date | — |
| Expiry date | May 16, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/80896
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for direct bonding between at least a first and a second substrate, each of the first and second substrates containing a first and a second main surface, the method including: a first thinning of the edges of the first substrate over at least one portion of the circumference of the first substrate, at the first main surface of the first substrate; and placing the second main surface of the first substrate in contact with the second main surface of the second substrate such that a bonding wave propagates between the first and second substrates, securing the first and second substrates to one another by direct bonding such that portions of the second main surface of the first substrate located below the thinned portions of the first main surface of the first substrate are secured to the second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.