Substrate processing apparatus and substrate processing method
US10500691B2 · kind B2 · utility
0Cited by
13References
18Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 28, 2017 |
| Grant date | Dec 10, 2019 |
| Priority date | — |
| Expiry date | Feb 16, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/44
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A substrate processing apparatus includes a polisher configured to polish a substrate using a polishing liquid, a first cleaner configured to clean the substrate polished by the polisher using sulfuric acid and hydrogen peroxide water, a second cleaner configured to clean the substrate cleaned by the first cleaner using a basic chemical liquid and hydrogen peroxide water, and a drier configured to dry the substrate cleaned by the second cleaner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.