Method of selectively removing tungsten over silicon oxide
US10501660B2 · kind B2 · utility
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Key dates
| Filing date | Mar 11, 2019 |
| Grant date | Dec 10, 2019 |
| Priority date | — |
| Expiry date | Mar 11, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/24
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Provided is a slurry composition including abrasive particles, halogen oxide, and nitroxide compound. The combination of halogen oxide and nitroxide compound has a synergistic effect to remove a substrate containing tungsten and silicon oxide. Moreover, a use of the slurry composition and a polishing method using the slurry composition are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.