Gas distribution apparatus for improved film uniformity in an epitaxial system
US10501866B2 · kind B2 · utility
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1,212References
18Claims
0Family size
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Key dates
| Filing date | Jan 19, 2017 |
| Grant date | Dec 10, 2019 |
| Priority date | — |
| Expiry date | Jul 23, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B25/165
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A gas distribution system is disclosed in order to obtain better film uniformity on a wafer. The better film uniformity may be achieved by utilizing an expansion plenum and a plurality of, for example, proportioning valves to ensure an equalized pressure or flow along each gas line disposed above the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.