Physical vapor deposition chamber with static magnet assembly and methods of sputtering
US10504705B2 · kind B2 · utility
1Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2017 |
| Grant date | Dec 10, 2019 |
| Priority date | — |
| Expiry date | Dec 14, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3452
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Magnetrons for plasma sputter chambers, plasma sputter chambers including magnetrons and methods of processing a substrate such as an EUV mask blank in a plasma sputter chamber are disclosed. The magnetron comprises a plurality of elongate magnets arranged in a pattern where there is an unbalance ratio greater than 1 and less than 3.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.