Laser processing method, substrate dicing method and substrate processing system for performing the same
US10504804B2 · kind B2 · utility
0Cited by
5References
20Claims
0Family size
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Key dates
| Filing date | Jul 19, 2018 |
| Grant date | Dec 10, 2019 |
| Priority date | — |
| Expiry date | Jul 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68336
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A laser processing method includes irradiating a laser light into a substrate along a cutting line to form a laser-scribed layer within the substrate, irradiating an X-ray onto a first surface of the substrate along the cutting line, obtaining an image of a diffracted X-ray from the substrate, and determining whether or not the laser-scribed layer is formed along the cutting line, based on analysis of the obtained image of the diffracted X-ray.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.