Semiconductor device and manufacturing method thereof
US10504827B2 · kind B2 · utility
2Cited by
43References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2016 |
| Grant date | Dec 10, 2019 |
| Priority date | — |
| Expiry date | Jun 3, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device and a method of manufacturing an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of manufacturing electronic devices, and electronic devices manufactured thereby, that comprise utilizing metal studs to further set a semiconductor die into the encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.