Substrate structure with spatial arrangement configured for coupling of surface plasmons to incident light

US10510675B2 · kind B2 · utility

Assignee

• GlobalFoundries Inc. · KY

Inventors

• Somnath Ghosh · Cumming, US
• Eswar Ramanathan · Mechanicville, US
• Qanit Takmeel · Latham, US
• Ming He · San Jose, US
• Jeric Sarad · Mechanicville, US
• Ashwini Chandrashekar · Clifton Park, US
• Colin Bombardier · Clifton Park, US
• Anbu Selvam KM Mahalingam · Mechanicville, US
• Keith Donegan · Saratoga Springs, US
• Prakash Periasamy · South Burlington, US

Key dates

• Filing date: Feb 5, 2018
• Grant date: Dec 17, 2019
• Expiry date: Mar 19, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2223/54426
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Embodiments of the disclosure provide a substrate structure for an integrated circuit (IC) structure, including: a first dielectric layer positioned above a semiconductor substrate; a first plurality of trenches extending at least partially into the first dielectric layer from an upper surface of the first dielectric layer; and a first metal formed within the first plurality of trenches, wherein a spatial arrangement of the first plurality of trenches causes coupling of surface plasmons in the first metal to at least one wavelength of an incident light.