Semiconductor device and method for manufacturing the same
US10510722B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2017 |
| Grant date | Dec 17, 2019 |
| Priority date | — |
| Expiry date | Oct 4, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/716
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a first electronic component, a second electronic component and a plurality of interconnection structures. The first electronic component has a first surface. The second electronic component is over the first electronic component, and the second electronic component has a second surface facing the first surface of the first electronic component. The interconnection structures are between and electrically connected to the first electronic component and the second electronic component, wherein each of the interconnection structures has a length along a first direction substantially parallel to the first surface and the second surface, a width along a second direction substantially parallel to the first surface and the second surface and substantially perpendicular to the first direction, and the length is larger than the width of at least one of the interconnection structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.