Device array backframe with integral manifolding for high performance fluid cooling
US10512152B2 · kind B2 · utility
16Cited by
1References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2018 |
| Grant date | Dec 17, 2019 |
| Priority date | — |
| Expiry date | Jul 17, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/064
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention generally relates to an array backframe with integral manifolding for high performance fluid cooling of devices. The integral manifolding of the array backframe is designed to perform three functions. First, the array backframe parallelizes the fluid paths to provide uniform, cool supply fluid to every device in the array. Second, the array backframe minimizes the parasitic heat losses between supply and exhaust by use of an isolation cavity. Third, the array backframe collapses hundreds of fluid lines into a single internal manifold to enhance modularity while also serving as a structural support member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.