Bernard Malouin
20Patents
7h-index
9Co-inventors
58Inventor score
Filing activity: Jul 26, 2011 → Mar 5, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10651112B2 | Thermal management of RF devices using embedded microjet arrays | Emerging Cross-Sectional Technologies | 17 | Active |
| US10512152B2 | Device array backframe with integral manifolding for high performance fluid cooling | Electricity | 16 | Active |
| US10665529B2 | Modular microjet cooling of packaged electronic components | Electricity | 16 | Active |
| US10903141B2 | Thermal management of RF devices using embedded microjet arrays | Emerging Cross-Sectional Technologies | 15 | Active |
| US11018077B2 | Modular microjet cooling of packaged electronic components | Electricity | 11 | Active |
| US11322426B2 | Thermal management of RF devices using embedded microjet arrays | Emerging Cross-Sectional Technologies | 10 | Active |
| US11594470B2 | Modular microjet cooling of packaged electronic components | Electricity | 9 | Active |
| US11277937B2 | Re-entrant flow cold plate | Electricity | 6 | Active |
| US8564884B2 | Reconfigurable, non-oscillating liquid lens and imaging systems | Emerging Cross-Sectional Technologies | 5 | Active |
| US11191184B2 | Direct contact fluid based cooling module | Electricity | 5 | Active |
| US11844193B2 | Direct contact fluid based cooling module | Electricity | 3 | Active |
| US8729515B2 | Pinned contact, oscillating liquid-liquid lens and imaging systems | Emerging Cross-Sectional Technologies | 3 | Active |
| US12016157B2 | Actively cooled heat-dissipation lids for computer processors and assemblies | Electricity | 1 | Active |
| US12048118B2 | Flow-through, hot-spot-targeting immersion cooling assembly | Emerging Cross-Sectional Technologies | 1 | Active |
| US11963341B2 | High temperature electronic device thermal management system | Electricity | 1 | Active |
| US12100643B2 | Thermal management of electronics using co-located microjet nozzles and electronic elements | Electricity | 1 | Active |
| US12289861B2 | Liquid-in-liquid cooling system for electronic components | Physics | 0 | Active |
| US12288733B2 | Conformal cooling assembly with substrate fluid-proofing for multi-die electronic assemblies | Electricity | 0 | Active |
| US12324126B2 | Actively cooled heat-dissipation lids for computer processors and processor assemblies | Electricity | 0 | Active |
| US12289871B2 | High temperature electronic device thermal management system | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.