Method for dividing substrate along division lines using abrasive member having projection for cutting substrate
US10515841B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2018 |
| Grant date | Dec 24, 2019 |
| Priority date | — |
| Expiry date | Jul 2, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a processing method for a package substrate having a plurality of division lines formed on the front side. The processing method includes the steps of holding the back side of the package substrate by using a holding tape and fully cutting the package substrate along the division lines to such a depth corresponding to the middle of the thickness of the holding tape by using a profile grinding tool, thereby dividing the package substrate into individual semiconductor packages. The profile grinding tool has a plurality of projections for cutting the package substrate respectively along the plural division lines. Each projection has an inclined side surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.