Inventor · Tokyo, JP

Byeongdeck Jang

22Patents
1h-index
9Co-inventors
39Inventor score

Filing activity: Dec 18, 2017 → Nov 4, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US10403520B2 Multi-blade and processing method of workpiece Electricity 1 Active
US10211164B2 Semiconductor package manufacturing method Electricity 1 Active
US10937668B2 Semiconductor package manufacturing method Electricity 1 Active
US10497623B2 Method of manufacturing a semiconductor package including a shield layer Electricity 0 Active
US11183464B2 Package substrate processing method and protective tape Electricity 0 Active
US11322476B2 Manufacturing method of producing shielded individual semiconductor packages Electricity 0 Active
US11289348B2 Workpiece processing method Electricity 0 Active
US10366907B2 Manufacturing method of semiconductor package Electricity 0 Active
US10861716B2 Processing method for package substrate Electricity 0 Active
US11682569B2 Workpiece cutting method Electricity 0 Active
US10515841B2 Method for dividing substrate along division lines using abrasive member having projection for cutting substrate Electricity 0 Active
US10431555B2 Method of manufacturing semiconductor package Electricity 0 Active
US11133198B2 Method of manufacturing packaged device chip Electricity 0 Active
US11508607B2 Method of processing workpiece and resin sheet unit Electricity 0 Active
US11114385B2 Plate-shaped workpiece processing method Electricity 0 Active
US11764114B2 Wafer manufacturing method and laminated device chip manufacturing method Electricity 0 Active
US11756831B2 Wafer manufacturing method and laminated device chip manufacturing method Electricity 0 Active
US12198990B2 Wafer manufacturing method and laminated device chip manufacturing method Electricity 0 Active
US12300545B2 Wafer manufacturing method and laminated device chip manufacturing method Electricity 0 Active
US11854891B2 Wafer manufacturing method and laminated device chip manufacturing method Electricity 0 Active
US11590629B2 Method of processing workpiece and resin sheet unit Performing Operations; Transporting 0 Active
US11764115B2 Wafer manufacturing method and laminated device chip manufacturing method Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.