Patent · US Active

Microelectromechanical device, an array of microelectromechanical devices, a method of manufacturing a microelectromechanical device, and a method of operating a microelectromechanical device

US10516943B2 · kind B2 · utility

1Cited by

1References

24Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Manuel Dorfmeister · Wien, AT
Michael Schneider · Wien, AT
Manfred Kaltenbacher · Wien, AT
Alfons Dehe · Reutlingen, DE
Ursula Hedenig · Villach, AT
Thomas Grille · Villach, AT
Ulrich Schmid · Wien, AT

Key dates

Filing date	May 4, 2016
Grant date	Dec 24, 2019
Priority date	—
Expiry date	Apr 24, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH04R2307/025
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

Aspects of a microelectromechanical device, an array of microelectromechanical devices, a method of manufacturing a microelectromechanical device, and a method of operating a microelectromechanical device, are discussed herein. The microelectromechanical device may include: a substrate; a diaphragm mechanically coupled to the substrate, the diaphragm comprising a stressed region to buckle the diaphragm into one of two geometrically stable positions; an actuator mechanically coupled to the diaphragm, the actuator comprising a piezoelectric layer over the diaphragm; a controller configured to provide an electrical control signal in response to a digital sound input; wherein the actuator is configured to receive the electrical control signal to exert a mechanical piezoelectric force on the diaphragm via the piezoelectric layer to move the diaphragm to create a sound wave.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.