Leveler compositions for use in copper deposition in manufacture of microelectronics
US10519557B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2017 |
| Grant date | Dec 31, 2019 |
| Priority date | — |
| Expiry date | Sep 1, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An aqueous electrolytic composition and a process for electrodeposition of copper on a dielectric or semiconductor base structure using the aqueous electrolytic composition. The process includes (i) contacting a metalizing substrate comprising a seminal conductive layer on the base structure with an aqueous electrolytic deposition composition; and (ii) supplying electrical current to the electrolytic deposition composition to deposit copper on the substrate. The aqueous electrolytic composition comprises: (a) copper ions; (b) an acid; (c) a suppressor; and (d) a quaternized poly(epihalohydrin) comprising n repeating units corresponding to structure 1N and p repeating units corresponding to structure 1P:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.