Inventor · Hamden, CT, US

Kyle Whitten

15Patents

2h-index

13Co-inventors

43Inventor score

Filing activity: Sep 15, 2015 → Jun 7, 2022

Most-cited inventions

Patent	Title	Area	Cited by	Status
US11035048B2	Cobalt filling of interconnects	Electricity	3	Active
US10519557B2	Leveler compositions for use in copper deposition in manufacture of microelectronics	Electricity	2	Active
US11401618B2	Cobalt filling of interconnects	Electricity	0	Active
US11807951B2	Cobalt chemistry for smooth topology	Emerging Cross-Sectional Technologies	0	Active
US11168406B2	Leveler compositions for use in copper deposition in manufacture of microelectronics	Electricity	0	Active
US11434578B2	Cobalt filling of interconnects in microelectronics	Chemistry; Metallurgy	0	Active
US11124888B2	Copper deposition in wafer level packaging of integrated circuits	Electricity	0	Active
US11384446B2	Compositions and methods for the electrodeposition of nanotwinned copper	Performing Operations; Transporting	0	Active
US12270121B2	Composition and method for fabrication of nickel interconnects	Electricity	0	Active
US11873568B2	Compositions and methods for the electrodeposition of nanotwinned copper	Performing Operations; Transporting	0	Active
US10995417B2	Cobalt filling of interconnects in microelectronics	Chemistry; Metallurgy	0	Active
US11230778B2	Cobalt chemistry for smooth topology	Emerging Cross-Sectional Technologies	0	Active
US10294574B2	Levelers for copper deposition in microelectronics	Chemistry; Metallurgy	0	Active
US11697884B2	Copper deposition in wafer level packaging of integrated circuits	Electricity	0	Active
US12398480B2	Leveler compositions for use in copper deposition in manufacture of microelectronics	Chemistry; Metallurgy	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.