Patent · US Active

Semiconductor device package and method for manufacturing the same

US10522505B2 · kind B2 · utility

4Cited by
68References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 12, 2018
Grant dateDec 31, 2019
Priority date—
Expiry dateMar 12, 2038

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/19105
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A surface mount structure includes a substrate, a sensor, an electrical contact and a package body. The substrate has a first surface and a second surface opposite to the first surface. The sensor is disposed adjacent to the second surface of the substrate. The electrical contact is disposed on the first surface of the substrate. The package body covers the first surface and the second surface of the substrate, a portion of the sensor and a first portion of the electrical contact.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.