Film forming apparatus
US10526702B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2016 |
| Grant date | Jan 7, 2020 |
| Priority date | — |
| Expiry date | Oct 30, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68721
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A film forming apparatus includes: a mounting table that is lifted/lowered between a processing location and a delivery location below the processing location; an encompassing member for encompassing the mounting table positioned at the processing location and to divide an inside of a processing container into a processing space of an upper space and a space of a lower side; an exhaust part for evacuating the inside of the processing container through the processing space; a purge gas supply unit configured to supply a purge gas to the lower side space; a clamp ring stacked on an upper surface of the encompassing member when the mounting table is positioned at the delivery location; and a guiding part formed at the encompassing member to be extended between an upper side of the mounting table and a lower side of the clamp ring and to guide a flow of the purge gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.