Film forming apparatus
US10526704B2 · kind B2 · utility
0Cited by
2References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2015 |
| Grant date | Jan 7, 2020 |
| Priority date | — |
| Expiry date | May 16, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A film forming apparatus includes a chamber having a processing space, a stage provided in the processing space and having a substrate placed thereon, a diffusion tube connected to the chamber so that a diffusion space communicating with the processing space is provided right above the stage, and a gas supply tube extending from the outside of the diffusion tube into the diffusion space through a portion of the diffusion tube and having a gas supply orifice in a portion thereof inside of the diffusion space. The gas supply orifice is formed so as to eject a material gas in a direction away from the stage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.