Endpointing for focused ion beam processing
US10529538B2 · kind B2 · utility
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30References
16Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 29, 2019 |
| Grant date | Jan 7, 2020 |
| Priority date | — |
| Expiry date | Jan 29, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31749
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
To expose a desired feature, focused ion beam milling of thin slices from a cross section alternate with forming a scanning electron image of each newly exposed cross section. Milling is stopped when automatic analysis of an electron beam image of the newly exposed cross section shows that a predetermined criterion is met.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.