Apparatus and method for treating substrate
US10529594B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2017 |
| Grant date | Jan 7, 2020 |
| Priority date | — |
| Expiry date | Mar 23, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02101
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the inventive concept relate to an apparatus for treating a substrate in a high-pressure atmosphere. The apparatus includes a process chamber having an upper body and a lower body that are combined with each other to provide a treatment space therein, an elevation member configured to elevate any one of the upper body and the lower body to an opening location at which the upper body and the lower body is spaced apart or a closing location at which the upper body and the lower body is attached, a clamping member configured to clamp the upper body and the lower body located at the closing location, and a movable member configured to move the clamping member to a locking location at which the clamping member clamps the process chamber or to the release location at which the clamping member is spaced apart from the process chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.