Polishing apparatus and wafer polishing method
US10532442B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 25, 2015 |
| Grant date | Jan 14, 2020 |
| Priority date | — |
| Expiry date | Apr 25, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/304
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus which is an index system polishing apparatus which includes a polishing head for holding a wafer, a plurality of turn tables to which polishing pads for polishing the wafer are attached, and a loading/unloading stage for loading the wafer to the polishing head or unloading the wafer from the polishing head, and which polishes the wafer while switching the turn tables to be used for polishing the wafer held at the polishing head by causing the polishing head to perform rotation movement, the polishing apparatus including a turn table upward and downward movement mechanism which allows the turn table to move upward and downward. With this polishing apparatus, it is possible to reduce an amount of displacement caused when moment load is applied on the polishing head during polishing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.