Tilted chip assembly for optical devices

US10539779B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Ludwig Heitzer · Regensburg, DE
• Derek Debie · Bogen, DE
• Klaus Elian · Alteglofsheim, DE
• Cyrus Ghahremani · Regensburg, DE
• Johannes Lodermeyer · Kinding, DE
• Oskar Neuhoff · Nittendorf, DE
• Johann Strasser · Schierling, DE

Key dates

• Filing date: Aug 10, 2017
• Grant date: Jan 21, 2020
• Expiry date: Aug 10, 2037

Classification

• Technology area (CPC —): General

Abstract

A microelectromechanical systems (MEMS) package assembly and a method of manufacturing the same is provided. The MEMS package assembly includes a substrate, a housing coupled to the substrate to form a cavity, wherein the housing includes a transparent plate disposed above and parallel to the substrate and is configured to permit a transmission of light therethrough, and a MEMS chip disposed within the cavity and including a first main surface proximal to the transparent plate and a second main surface opposite to the first main surface and coupled to the substrate. The MEMS chip is oriented such that the first main surface is tilted at a tilt angle with respect to the transparent plate.