Inventor · Kinding, DE

Johannes Lodermeyer

13Patents

3h-index

44Co-inventors

56Inventor score

Filing activity: Apr 19, 2007 → Dec 20, 2018

Most-cited inventions

Patent	Title	Area	Cited by	Status
US9331060B2	Device including two power semiconductor chips and manufacturing thereof	Electricity	43	Active
US8975711B2	Device including two power semiconductor chips and manufacturing thereof	Electricity	15	Active
US10549985B2	Semiconductor package with a through port for sensor applications	Performing Operations; Transporting	3	Active
US9437516B2	Chip-embedded packages with backside die connection	Electricity	1	Active
US10923364B2	Methods for producing packaged semiconductor devices	Electricity	0	Active
US11387533B2	Semiconductor package with plastic waveguide	Electricity	0	Active
US7989930B2	Semiconductor package	Emerging Cross-Sectional Technologies	0	Active
US10539779B2	Tilted chip assembly for optical devices	General	0	Revoked
US12368111B2	Semiconductor apparatuses with radio-frequency line elements, and associated manufacturing methods	Electricity	0	Active
US8603864B2	Method of fabricating a semiconductor device	Electricity	0	Active
US10734352B2	Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement	Electricity	0	Active
US7909978B2	Method of making an integrated circuit including electrodeposition of metallic chromium	Chemistry; Metallurgy	0	Active
US10571682B2	Tilted chip assembly for optical devices	Physics	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.