Patent · US Active

Graphics processing integrated circuit package

US10540318B2 · kind B2 · utility

1Cited by

1References

17Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Altug Koker · Cameron Park, US
Farshad Akhbari · Chandler, US
Feng Chen · Shanghai, CN
Dukhwan Kim · Mountain View, US
Narayan Srinivasa · Thousand Oaks, US
Nadathur Rajagopalan Satish · Santa Clara, US
Liwei Ma · Beijing, CN
Jeremy Bottleson · Rancho Cordova, US
Eriko Nurvitadhi · Beaverton, US
Joydeep Ray · Folsom, US
Ping T. Tang · Edison, US
Michael S. Strickland · Sunnyvale, US
Xiaoming Chen · Xi'an, CN
Tatiana Shpeisman · Menlo Park, US
Abhishek R. Appu · Cameron Park, US

Key dates

Filing date	Apr 9, 2017
Grant date	Jan 21, 2020
Priority date	—
Expiry date	May 28, 2037

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02D10/00
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

An integrated circuit (IC) package apparatus is disclosed. The IC package includes one or more processing units and a bridge, mounted below the one or more processing unit, including one or more arithmetic logic units (ALUs) to perform atomic operations.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.