Patent · US Active

Method and structure for flip-chip package reliability monitoring using capacitive sensors groups

US10553503B2 · kind B2 · utility

0Cited by

13References

9Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Taryn J. Davis · Beacon, US
Jonathan Fry · Fishkill, US
Tuhin Sinha · Oradell, US

Key dates

Filing date	Oct 2, 2017
Grant date	Feb 4, 2020
Priority date	—
Expiry date	Oct 2, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/73253
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Flip-chip package reliability monitoring and systems of monitoring using capacitive sensors are disclosed. The monitoring is conducted in situ and in real-time without the need for destructive testing of the packages. The capacitive sensors can be used for flip-chip package reliability monitoring.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.