Patent · US Active

Self-assembly of semiconductor die onto a leadframe using magnetic fields

US10553573B2 · kind B2 · utility

0Cited by

32References

18Claims

0Family size

Assignee

TEXAS INSTRUMENTS INCORPORATED · US

Inventors

Daniel Lee Revier · Addison, US
Steven Kummerl · Carrollton, US
Benjamin Stassen Cook · Addison, US

Key dates

Filing date	Sep 1, 2017
Grant date	Feb 4, 2020
Priority date	—
Expiry date	Sep 1, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/14
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Integrated circuits may be assembled by placing a batch of integrated circuit (IC) die on a leadframe. Each of the IC die includes a magnetically responsive structure that may be an inherent part of the IC die or may be explicitly added. The IC die are then agitated to cause the IC die to move around on the leadframe. The IC die are captured in specific locations on the leadframe by an array of magnetic domains that produce a magnetic response from the plurality of IC die. The magnetic domains may be formed on the lead frame, or may be provided by a magnetic chuck positioned adjacent the leadframe.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.