FinFETs having gates parallel to fins
US10553707B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2018 |
| Grant date | Feb 4, 2020 |
| Priority date | — |
| Expiry date | Aug 22, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/038
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods form devices by patterning a lower layer to form a fin, and forming a sacrificial gate along sidewalls of the fin. Such methods form a mask with cut openings on the sacrificial gate and remove sections of the fin and the sacrificial gate exposed through the cut openings to divide the fin into fin portions and create cut areas between the fin portions. Additionally, these methods remove the mask, epitaxially grow source/drains in the cut areas, replace the sacrificial gate with a gate conductor, and form a gate contact on the gate conductor over a center of the fin portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.