Compositions comprising sulfonamide material and processes for photolithography
US10558122B2 · kind B2 · utility
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1References
12Claims
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Key dates
| Filing date | Apr 13, 2015 |
| Grant date | Feb 11, 2020 |
| Priority date | — |
| Expiry date | Apr 13, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0757
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
New photoresist compositions are provided that are useful for immersion lithography. Preferred photoresist compositions of the invention comprise one or more materials that have sulfonamide substitution. Particularly preferred photoresists of the invention can exhibit reduced leaching of resist materials into an immersion fluid contacting the resist layer during immersion lithography processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.