Device with integration of light-emitting diode, light sensor, and bio-electrode sensors on a substrate

US10566493B1 · kind B1 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Steve Holmes · Cambridge, GB
• Devendra K. Sadana · Pleasantville, US
• Stephen W. Bedell · Wappingers Falls, US
• Bruce B. Doris · Brewster, US
• Hariklia Deligianni · Alpine, US
• Jia Chen · New York, US

Key dates

• Filing date: Jul 31, 2018
• Grant date: Feb 18, 2020
• Expiry date: Jul 31, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/01335

Abstract

A semiconductor device includes a substrate and a buffer layer disposed on a first portion, a second portion, and a third portion of the substrate. The semiconductor device further includes a multilayer light-emitting diode (LED) stack disposed on the first portion of the substrate, and an optical sensor disposed on the second portion of the substrate. The semiconductor device further includes at least one electrode disposed on the third portion of the substrate, a first conductor in contact with the multilayer LED stack, and a second conductor in contact with the optical sensor. The at least one electrode, the first conductor, and the second conductor are formed of a glassy carbon material.