Patent · US Active

Tilted chip assembly for optical devices

US10571682B2 · kind B2 · utility

0Cited by

4References

16Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Ludwig Heitzer · Regensburg, DE
Derek Debie · Bogen, DE
Klaus Elian · Alteglofsheim, DE
Cyrus Ghahremani · Regensburg, DE
Johannes Lodermeyer · Kinding, DE
Oskar Neuhoff · Nittendorf, DE
Johann Strasser · Schierling, DE

Key dates

Filing date	Aug 10, 2017
Grant date	Feb 25, 2020
Priority date	—
Expiry date	Aug 10, 2037

Classification

Technology area (CPC G)Physics
CPC primaryG01S7/4811
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A microelectromechanical systems (MEMS) package assembly and a method of manufacturing the same is provided. The MEMS package assembly includes a substrate, a housing coupled to the substrate to form a cavity, wherein the housing includes a transparent plate disposed above and parallel to the substrate and is configured to permit a transmission of light therethrough, and a MEMS chip disposed within the cavity and including a first main surface proximal to the transparent plate and a second main surface opposite to the first main surface and coupled to the substrate. The MEMS chip is oriented such that the first main surface is tilted at a tilt angle with respect to the transparent plate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.