Film forming method and vertical thermal processing apparatus
US10573518B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 23, 2018 |
| Grant date | Feb 25, 2020 |
| Priority date | — |
| Expiry date | Mar 23, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02658
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of performing a film formation on target substrates in a state where a substrate holder for holding the target substrates in a shelf shape is loaded into a vertical reaction container from a lower opening thereof and the lower opening is closed by a lid. The method includes: performing the film formation on the target substrates by supplying a processing gas into the reaction container; opening the lid and unloading the substrate holder from the reaction container; performing the film formation on a bottom portion of the reaction container including an inner surface of the lid by closing the lower opening with the lid and supplying a coating gas different from the processing gas into the reaction container; and performing the film formation on the target substrates by opening the lid, loading the substrate holder into the reaction container, and supplying the processing gas into the reaction container.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.