Patent · US Active

Method of reducing a sheet resistance in an electronic device, and an electronic device

US10573533B2 · kind B2 · utility

1Cited by

2References

13Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Edward Fuergut · Nuremberg, DE
Irmgard Escher-Poeppel · Regensburg, DE
Stephanie Fassl · Villach, AT
Paul Ganitzer · Villach, AT
Gerhard Poeppel · Duggendorf, DE
Werner Schustereder · Villach, AT
Harald Wiedenhofer · Bad Abbach, DE

Key dates

Filing date	Aug 29, 2018
Grant date	Feb 25, 2020
Priority date	—
Expiry date	Aug 29, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L23/3157
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Various embodiments provide a method of reducing a sheet resistance in an electronic device encapsulated at least partially in an encapsulation material, wherein the method comprises: providing an electronic device comprising a multilayer structure and being at least partially encapsulated by an encapsulation material; and locally introducing energy into the multilayer structure for reducing a sheet resistance.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.