Current sensor packages with through hole in semiconductor
US10573803B1 · kind B1 · utility
4Cited by
9References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2018 |
| Grant date | Feb 25, 2020 |
| Priority date | — |
| Expiry date | Aug 21, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R15/207
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor package includes a semiconductor die. A through hole in the semiconductor package and semiconductor die extends from one side of the semiconductor package and die to an opposite side of the semiconductor package and die. The through hole is configured to receive a current-carrying conductor there through. At least one current sensor is formed in, or on, the semiconductor die and configured to sense current flow in the current-carrying conductor received in the through hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.