Inventor · Gilbert, AZ, US

Michael J. Seddon

169Patents
10h-index
54Co-inventors
83Inventor score

Filing activity: Jun 1, 1998 → Jun 13, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US6300679A Flexible substrate for packaging a semiconductor component Electricity 163 Expired
US6164523A Electronic component and method of manufacture Emerging Cross-Sectional Technologies 124 Expired
US7989319B2 Semiconductor die singulation method Electricity 53 Active
US8012857B2 Semiconductor die singulation method Electricity 53 Active
USD489338S1 Packaged semiconductor device General 40 Expired
USD510728S1 Semiconductor device package General 34 Expired
USD504874S1 Semiconductor device package General 32 Expired
US8384231B2 Method of forming a semiconductor die Electricity 31 Active
US7319266B2 Encapsulated electronic device structure Electricity 22 Expired
US8664089B1 Semiconductor die singulation method Electricity 16 Active
US9337098B1 Semiconductor die back layer separation method Electricity 10 Active
US9564409B2 Methods of forming semiconductor packages with an intermetallic layer comprising tin and at least one of silver, copper or nickel Electricity 10 Active
US8292690B2 Thinned semiconductor wafer and method of thinning a semiconductor wafer Electricity 10 Active
US9793186B1 Semiconductor wafer and method of backside probe testing through opening in film frame Electricity 9 Active
US10388526B1 Semiconductor wafer thinning systems and related methods Electricity 8 Active
US9847310B2 Flip chip bonding alloys Emerging Cross-Sectional Technologies 7 Active
US10607889B1 Jet ablation die singulation systems and related methods Electricity 6 Active
US8084335B2 Method of thinning a semiconductor wafer using a film frame Electricity 6 Active
US9484210B2 Semiconductor die singulation method Electricity 6 Active
US10090233B2 Semiconductor device and method of forming micro interconnect structures Electricity 5 Active
US7755179B2 Semiconductor package structure having enhanced thermal dissipation characteristics Electricity 5 Expired
US9852972B2 Semiconductor device and method of aligning semiconductor wafers for bonding Electricity 4 Active
US7265454B2 Semiconductor device and method of producing high contrast identification mark Electricity 4 Active
US10573803B1 Current sensor packages with through hole in semiconductor Physics 4 Active
US7135356B2 Semiconductor device and method of producing a high contrast identification mark Electricity 4 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.