Spot heater and device for cleaning wafer using the same
US10576582B2 · kind B2 · utility
2Cited by
26References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2018 |
| Grant date | Mar 3, 2020 |
| Priority date | — |
| Expiry date | Jul 9, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A spot heater and a device for cleaning a wafer using the same are provided. The wafer cleaning device includes a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer; a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; and a spot heater configured to heat a spot of the top surface of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.