Cleaning compositions for removing post etch residue
US10577567B2 · kind B2 · utility
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19Claims
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Assignee
Inventors
Key dates
| Filing date | Nov 22, 2017 |
| Grant date | Mar 3, 2020 |
| Priority date | — |
| Expiry date | Dec 4, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The disclosure relates to a cleaning composition that aids in the removal of post-etch residues in the production of semiconductors. There is provided a stock composition comprising: a tetraalkylammonium hydroxide base or a quaternary trialkylalkanolamine base; a corrosion inhibitor; and a combination of at least two or more polyprotic acids or salts thereof, wherein at least one said polyprotic acid or salt thereof contains phosphorous.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.